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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

6.2K Views

09:06 min

July 3rd, 2020

DOI :

10.3791/61468-v

July 3rd, 2020


Transcrição

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Adhesive Systems

Capítulos neste vídeo

0:05

Introduction

0:41

Manufacturer Curing Condition Checking: Thermogravimetric Cured Sample Testing

1:20

Manufacturer Curing Condition Checking: Differential Scanning Calorimetry (DSC) of a Cured Sample

2:29

DSC Fresh Sample Analysis: Ramp Curing Test

3:23

DSC Fresh Sample Analysis: Isothermal Curing Test

4:47

Logarithmic Strain Sweep Test

5:27

Isothermal Multifrequency Curing Test

6:22

Torque sweep and Temperature Scan Testing

7:18

Results: Representative Cured Adhesive System Rheological and Thermal Testing

8:42

Conclusion

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